| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a solder resist composition having high reflectance and high resolution, and to provide a printed wiring board having a solder resist formed by using the composition. <P>SOLUTION: The solder resist composition comprises: a resin having an ethylenically unsaturated group and a carboxyl group in one molecule; a bisacylphosphine oxide-based photopolymerization initiator; a monoacylphosphine oxide-based photopolymerization initiator; a photopolymerizable monomer, titanium oxide, an epoxy compound, and an organic solvent. <P>COPYRIGHT: (C)2012,JPO&INPIT |
