发明名称 HIGH EFFICIENCY ELECTROSTATIC CHUCK ASSEMBLY FOR SEMICONDUCTOR WAFER PROCESSING
摘要 <P>PROBLEM TO BE SOLVED: To provide a high efficiency electrostatic chuck assembly including a flex stack having an electrode disposed between two dielectric layers. <P>SOLUTION: At least one dielectric layer is a standard or high purity thermoplastic film. A flex stack 112 may have a matte finish on a substrate support surface 132 of a first dielectric layer 124 to provide benefits such as improved temperature distribution across the surface of the electrostatic chuck. A non-substrate support surface or pedestal receiving side of the flex stack may be plasma-treated to provide a desired surface finish, which is then bonded to a pedestal using an acrylic or epoxy adhesive resulting in superior bonding strength compared to traditional polymer electrostatic chucks. An electrode 122 may be a sheet electrode on a release liner, which enables ease of manufacturing. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012129498(A) 申请公布日期 2012.07.05
申请号 JP20110213394 申请日期 2011.09.08
申请人 APPLIED MATERIALS INC 发明人 ASHISH BHATNAGAR;MONIKA AGARWAL;PADMA GOPALAKRISHNAN;DANIEL MARTIN
分类号 H01L21/683;H02N13/00 主分类号 H01L21/683
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