SEMICONDUCTOR WAFER AND MANUFACTURING METHOD THEREOF

摘要

PROBLEM TO BE SOLVED: To provide a semiconductor wafer in which peripheral sagging (edge roll-off)of a semiconductor wafer has been improved within a desired value without association with a factor of production cost increase and a method for manufacturing such a semiconductor wafer.

SOLUTION: A manufacturing method of a semiconductor wafer includes: a slicing step of obtaining a semiconductor wafer by slicing a single crystal ingot; a chamfering step of chamfering an outer peripheral part of the semiconductor wafer obtained by the slicing step; a flattening step of flattening the chamfered semiconductor wafer; and a polishing step of polishing at least one of principal surfaces of the flattened semiconductor wafer. The chamfering step adjusts an angle between the principal part and an inclined surface of the chamfering part within a range of 30° or higher and 40° or lower according to a standard of an edge roll-off amount in the chamfering part of the principal surface side to be polished by at least the polishing step out of the principal surfaces of the semiconductor wafer.

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