发明名称 |
SEMICONDUCTOR DEVICE HAVING A COPPER PLUG |
摘要 |
Disclosed is a process of making a semiconductor device wherein an insulation layer has a copper plug in contact with the last wiring layer of the device. There may also be a barrier layer separating the copper plug from the insulation layer. There may also be a cap layer over the copper plug to protect it from oxidation. There may also be a dielectric layer over the cap layer.
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申请公布号 |
US2012168952(A1) |
申请公布日期 |
2012.07.05 |
申请号 |
US201213418261 |
申请日期 |
2012.03.12 |
申请人 |
FAROOQ MUKTA G.;KINSER EMILY R.;MELVILLE IAN D.;SEMKOW KRYSTYNA W.;INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
FAROOQ MUKTA G.;KINSER EMILY R.;MELVILLE IAN D.;SEMKOW KRYSTYNA W. |
分类号 |
H01L23/522;H01L21/768 |
主分类号 |
H01L23/522 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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