发明名称 |
DICING DIE BONDING FILM, SEMICONDUCTOR WAFER, AND SEMICONDUCTOR DEVICE |
摘要 |
A dicing die bonding film including a bonding layer; and a pressure-sensitive adhesive layer adjoining the bonding layer, the pressure-sensitive adhesive layer having a storage modulus of about 400 to about 600 kPa at 25° C. and a peel strength of about 200 to about 350 mN/25 mm with respect to the bonding layer as measured according to KS-A-01107 standard. |
申请公布号 |
US2012171844(A1) |
申请公布日期 |
2012.07.05 |
申请号 |
US201113287367 |
申请日期 |
2011.11.02 |
申请人 |
HWANG MIN KYU;KIM JI HO;SONG KI TAE |
发明人 |
HWANG MIN KYU;KIM JI HO;SONG KI TAE |
分类号 |
H01L21/78;B32B27/00;B32B27/30;B32B27/38;C09J7/02;H01L23/00 |
主分类号 |
H01L21/78 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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