PACKAGE STRUCTURE

摘要

A package structure including a first substrate, a second substrate and a light emitting diode is provided. The first substrate has at least a first annular engaged portion. The second substrate is disposed above the first substrate and has at least a second annular engaged portion. The light emitting diode is disposed on the first substrate. The second annular engaged portion is infixed to the first annular engaged portion so as to form an airtight space. The light emitting diode is located in the airtight space.