发明名称 PLATING CATALYST AND METHOD
摘要 <P>PROBLEM TO BE SOLVED: To provide stable zero-valent metal compositions that are useful as catalysts for metallization of a non-conductive substrate zero-valent metal, and to provide methods of making and using these compositions. <P>SOLUTION: The composition contains: a zero-valent metal selected from 0.5-100 ppm of Pd, Ag, Co, Ni, Au, Cu and Ru; a stabilizer; and water. The composition is prepared by mixing water, a water-soluble metallic salt and a specific stabilizer, and then adding sufficient amount of reducer to form a zero-valent metal. The composition is especially useful for electroless metal plating of a non-conductive substrate used for manufacturing of electronic devices. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012127002(A) 申请公布日期 2012.07.05
申请号 JP20110271851 申请日期 2011.12.13
申请人 ROHM & HAAS ELECTRONIC MATERIALS LLC 发明人 LIU FENG;RZEZNIK MARIA ANNA
分类号 C23C18/30;B01J23/44;B01J23/46;B01J23/50;B01J23/72;B01J23/75;B01J23/89;B01J37/16 主分类号 C23C18/30
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