发明名称 VACUUM DEPOSITION DEVICE AND METHOD FOR FORMING THIN FILM
摘要 <P>PROBLEM TO BE SOLVED: To provide a vacuum deposition device in which a film thickness sensor has a long service life, and a method for forming a thin film. <P>SOLUTION: The vacuum deposition device 2 forms the thin film on a substrate 26 held by a substrate holder 25 and includes: a vacuum tank 21; a vacuum pumping unit 27 for evacuating the vacuum tank 21; discharging units 12a and 12b for discharging vapor of a vapor deposition material from discharge openings 11a and 11b exposed in the vacuum tank 21; the substrate holder 25 for holding the substrate 26 at a position facing the discharge openings 11a and 11b a; and the film thickness sensors 15a and 15b disposed at positions of the incidence of the discharged vapor for measuring a film thickness of a deposited film formed of deposited vapor. The vacuum deposition device has laser irradiation units 18a and 18b for irradiating laser beams to the film thickness sensors 15a and 15b. When the laser beam are irradiated to the deposited films deposited on the film thickness sensors 15a and 15b, the deposited films are removed from the film thickness sensors 15a and 15b. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012126938(A) 申请公布日期 2012.07.05
申请号 JP20100277572 申请日期 2010.12.14
申请人 ULVAC JAPAN LTD 发明人 YO ITSUSHIN
分类号 C23C14/54;C23C14/24;C23C14/52;H01L51/50;H05B33/10 主分类号 C23C14/54
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