| 摘要 |
Provided is a semiconductor device/electronic component mounting structure capable of suppressing temperature increases associated with heat generated by a semiconductor device or an electronic component that have large power consumption, and enabling stable operation. The semiconductor device/electronic component mounting structure comprises: an interposer (10); a semiconductor device (11) mounted to the surface (10a) of the interposer (10); and a cover (12) adhered/fixed to the surface (10a) of the interposer (10) so as to contain the semiconductor device (11) and which forms an internal space (S) with the interposer (10). The cover (12) has: an inlet (13) that guides, from outside to inside the internal space (S), a liquid (L) that absorbs heat; and an outlet (14) that discharges the liquid (L) from the internal space (S) to outside. Excluding the inlet (13) and the outlet (14), the internal space (S) is a closed space. |
