RESIN COMPOSITION, PROTECTIVE FILM CONTAINING SAME, DRY FILM, CIRCUIT BOARD, AND MULTILAYER CIRCUIT BOARD

摘要

One purpose of the present invention is to provide: a resin composition which is capable of forming a film that has excellent heat resistance and slidability/bendability; a protective film for circuits, which uses the resin composition; and a dry film or the like which comprises the protective film. Another purpose of the present invention is to provide a circuit board and a multilayer circuit board, each of which has excellent heat resistance and slidability/bendability. In order to achieve the above-described purposes, a protective film for circuit boards, which is arranged in contact with a circuit of a printed wiring board, contains a polyoxazolidone resin (A) that has a weight average molecular weight of 3 × 104 or more.