| 摘要 |
<p>Abstract A force sensor (10) is disclosed. In one illustrative embodiment, the force sensor (10) may include a sensing die (20) mounted to a substrate (12) and an actuation assembly for transmittinE an external force to the sensing die (20). The sensing die (20) may include a diaphragm (22) and one or more sensing elements (e.g. piezoresistive elements) positioned on the diaphragm (22). The actuation assembly may include a spherical member or object (40) (e.g. ball bearing) in contact with the diaphragm (22), a pin member (41) having a first end (42) coupled to the spherical object (40) and a second end (43) coupled to a button member (44, 644). The actuator assembly may transmit a force applied to the button member (44, 644) to the diaphragm (22) via the pin member (41) and spherical member. In some cases, the front side of the sensing die (20) may be mounted to the substrate (12) with an adhesive (13 1), such as a pattern of conductive adhesive (416) and nonconductive adhesive (4 14) to electrically connect one or more bond pads (4 12) of the sensing die (20) to one or more bond pads (4 12) of the substrate (12) without the need for wire bonds. The force sensor (10) may also include signal conditioning circuitry ( 127). 1 of 6 (N kcI</p> |
