| 摘要 |
<P>PROBLEM TO BE SOLVED: To improve temperature characteristics of a sensor chip as compared with a conventional case using beads as a spacer. <P>SOLUTION: In a method for manufacturing a dynamic quantity sensor in which a sensor chip 3 is stuck to an adherend 4 through high molecular adhesive 2 for easing thermal stress by elastic deformation, the same material as the adhesive 2 is cured on a part of an adhesion scheduled area of the adherend 4 to the sensor chip 3 to form a spacer 12 for holding an interval between the sensor chip 3 and the adherend 4. In the formation of the spacer 12, application and curing of the same material as the adhesive 2 in a droplet state are repeated several times. While holding the sensor chip 3 by the spacer 12, the adhesive 2 between the sensor chip 3 and the adherend 4 is cured. Since the spacer 12 reaches the same Young's modulus as that of the adhesive 2 after curing the adhesive 2, and when the adhesive 2 is contracted by a temperature change, stress received from the spacer 12 to the sensor chip 3 can be reduced and the temperature characteristics of the sensor chip 3 can be improved. <P>COPYRIGHT: (C)2012,JPO&INPIT |
