发明名称 Methods and Structures Involving Terminal Connections
摘要 A method for forming a conductive contact includes forming a copper contact region in an intermediary layer, depositing an insulator layer over the copper contact region and the intermediary layer, patterning a photoresist layer on the insulator layer, etching to remove a portion of the insulator layer and expose a portion of the copper contact region, depositing a conductive material layer over the exposed portion of the copper contact region and the photoresist layer, and removing the photoresist layer and the conductive material layer disposed on the photoresist layer.
申请公布号 US2012168210(A1) 申请公布日期 2012.07.05
申请号 US20110984640 申请日期 2011.01.05
申请人 HOOK TERENCE B.;RAMACHANDRAN VIDHYA;INTERNATIONAL BUSINESS MACHINES CORPORATION 发明人 HOOK TERENCE B.;RAMACHANDRAN VIDHYA
分类号 H05K1/09;G03F7/20 主分类号 H05K1/09
代理机构 代理人
主权项
地址
您可能感兴趣的专利