METHOD OF FABRICATING A COMPOSITE STRUCTURE WITH A CONDUCTIVE SURFACE

摘要

A method of fabricating a composite structure having a conductive surface is disclosed herein. The composite structure is formed by laminating a self-surfacing, conductive prepreg to one or prepreg plies or tapes to form a layup. The self- surfacing, conductive prepreg comprises a conductive surfacing film with a conductivity of less than 20 milliOhms formed on at least one surface of a prepreg ply or tape. Furthermore, the self-surfacing, conductive prepreg is suitable for use in an Automated Fiber Placement (AFP) process.