发明名称 CURABLE COMPOSITION
摘要 <P>PROBLEM TO BE SOLVED: To provide a curable composition having high hardness, which can be used as an adhesive or a coating agent. <P>SOLUTION: The curable composition includes: (A) 100 pts.wt. of a reactive silicon group-containing organic polymer which has a number-average molecular weight of 2,000-6,000 and contains 1.3-5 reactive silicon groups in each molecule; and (C) 0-40 pts.wt. of a plasticizer, and is used. The curable composition is suitable for an adhesive for floors or an adhesive for tiling, the adhesive being required to have high hardness. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012126881(A) 申请公布日期 2012.07.05
申请号 JP20110136549 申请日期 2011.06.20
申请人 KANEKA CORP 发明人 MIYAFUJI SEI;YANO MASAKO
分类号 C08L101/10;C08L71/02;C09J11/06;C09J171/02;C09J201/00 主分类号 C08L101/10
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