发明名称 LIGHT-EMITTING DIODE CHIP
摘要 A light-emitting diode chip is specified, comprising - a semiconductor body (1) comprising a radiation-generating active region (13), - at least two contact locations (2a, 2b) for making electrical contact with the active region, - a carrier (3) and - a connecting means (4), arranged between the carrier (3) and the semiconductor body (1), wherein - the semiconductor body (1) has a roughening (15) at its outer surfaces facing the carrier (3), - the semiconductor body (1) is mechanically connected to the carrier (3) by means of the connecting means (4), - the connecting means (4) is in direct contact with the semiconductor body (1) and the carrier (3) in some locations, and - the at least two contact locations (2a, 2b) are arranged at the top side of the semiconductor body (1) that faces away from the carrier (3).
申请公布号 WO2012028460(A3) 申请公布日期 2012.07.05
申请号 WO2011EP64185 申请日期 2011.08.17
申请人 OSRAM OPTO SEMICONDUCTORS GMBH;HOEPPEL, LUTZ;VON MALM, NORWIN;SABATHIL, MATTHIAS 发明人 HOEPPEL, LUTZ;VON MALM, NORWIN;SABATHIL, MATTHIAS
分类号 H01L33/22;H01L25/075;H01L33/00 主分类号 H01L33/22
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