发明名称 |
VERTICAL TRANSISTOR MANUFACTURING METHOD AND VERTICAL TRANSISTOR |
摘要 |
A method is disclosed of manufacturing a vertical transistor which comprises providing a substrate including a vertical stack of regions including a source region separated from a drain region by a channel region; forming a trench in said substrate, said trench at least partially extending into said vertical stack of regions; lining said trench with a stack comprising a gate dielectric liner, an etch protection layer and a further insulating layer; filling the remainder of the trench with a shield electrode material; exposing a top portion of the shield electrode material by removing the further insulating layer to a first depth in said trench; forming a inter electrode dielectric on the exposed shield electrode material; removing the etch protection layer to the first depth from said trench; and forming a gate electrode in said trench between the inter electrode dielectric liner and the exposed portion of the gate dielectric liner. |
申请公布号 |
US2012168859(A1) |
申请公布日期 |
2012.07.05 |
申请号 |
US201113330920 |
申请日期 |
2011.12.20 |
申请人 |
JIN MINGHAO;CALTON DAVID WILLIAM;KERSHAW NICK;ROGERS CHRIS;NXP B.V. |
发明人 |
JIN MINGHAO;CALTON DAVID WILLIAM;KERSHAW NICK;ROGERS CHRIS |
分类号 |
H01L29/78;H01L21/336 |
主分类号 |
H01L29/78 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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