发明名称 |
PHOTOCURABLE RESIN COMPOSITION, DRY FILM AND CURED OBJECT OBTAINED THEREFROM, AND PRINTED WIRING BOARD OBTAINED USING THESE |
摘要 |
<p>The purpose of the present invention is to provide a photocurable and alkaline-solution-developable resin composition which, even when containing a filler incorporated in a large quantity, gives a solder resist that has satisfactory handleability and can be inhibited from cracking or peeling off during thermal shock cycles. The composition comprises a carboxylated oligomer, a polymeric binder that has a higher molecular weight than the carboxylated oligomer, a photopolymerization initiator, a photopolymerizable monomer, and a filler, wherein the content of the filler is 30-60 mass% with respect to the total amount of the nonvolatile components of the composition. A thermoplastic resin is suitable as the polymeric binder, and the thermoplastic resin preferably is in the state of having been dissolved in a solvent so that the thermoplastic-resin solution has a solid content of 10-50 wt.%. The photocurable resin composition or a dry film obtained therefrom is advantageously applicable to the formation of a cured film such as the solder resist of a printed wiring board.</p> |
申请公布号 |
WO2012090532(A1) |
申请公布日期 |
2012.07.05 |
申请号 |
WO2011JP63913 |
申请日期 |
2011.06.17 |
申请人 |
TAIYO INK MFG. CO., LTD.;MINEGISHI, SHOJI;ARIMA, MASAO |
发明人 |
MINEGISHI, SHOJI;ARIMA, MASAO |
分类号 |
G03F7/032;G03F7/004 |
主分类号 |
G03F7/032 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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