发明名称 |
MULTILAYER WIRING BOARD AND METHOD FOR MANUFACTURING MULTILAYER WIRING BOARD |
摘要 |
<p>A multilayer wiring board provided with a via hole conductor for connecting a first copper wiring and a second copper wiring; the via hole conductor including a metal portion and a resin portion; the metal portion having a first metal region including a combined body of copper particles forming a pathway for electrically connecting the first copper wiring and the second copper wiring, a second metal region having as a principal component at least one type of metal selected from the group consisting of tin, a tin-copper alloy, and a tin-copper intermetallic compound, and a third metal region having bismuth as a principal component; the copper particles forming the combined body being in surface contact with each other; the first copper wiring, the second copper wiring, and the copper particles being in surface contact with each other; and a portion where the first copper wiring and/or the second copper wiring are in surface contact with the copper particles being covered with at least a portion of the second metal region.</p> |
申请公布号 |
WO2012090402(A1) |
申请公布日期 |
2012.07.05 |
申请号 |
WO2011JP06885 |
申请日期 |
2011.12.09 |
申请人 |
PANASONIC CORPORATION;HIGUCHI, TAKAYUKI;HIRAI, SHOGO;HIMORI, TSUYOSHI;ISHITOMI, HIROYUKI |
发明人 |
HIGUCHI, TAKAYUKI;HIRAI, SHOGO;HIMORI, TSUYOSHI;ISHITOMI, HIROYUKI |
分类号 |
H05K3/46;H01L23/12;H05K1/11;H05K3/40 |
主分类号 |
H05K3/46 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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