| 摘要 |
<p>PURPOSE: A method for manufacturing an LED package is provided to improve luminous efficiency by uniformly spraying fluorescent substances which are filled in a cavity. CONSTITUTION: A cavity(130) with an opened top side is formed on a substrate(110). A side wall(120) comprising the substrate is formed on both sides of the cavity. A light emitting chip(140) is mounted in the cavity and is wire-bonded to be electrically connected to the substrate. A resin unit(160) is formed by filling fluorescent substances(151) in the cavity.</p> |
