发明名称 ASSEMBLY COMPRISING AN ELECTRONIC CIRCUIT WAFER AND A MEMBER SUPPORTING SAID WAFER, AND A METHOD FOR ASSEMBLING SAME
摘要 The invention relates to an assembly of an electronic circuit wafer (11) and a member (12) supporting said wafer, said assembly furthermore comprising an additional material (13) allowing said wafer (11) to be adhesively bonded to said supporting member (12). The invention also relates to a method for assembling an electronic circuit wafer (11) and a member (12) that supports said wafer.
申请公布号 WO2012089971(A1) 申请公布日期 2012.07.05
申请号 WO2011FR53167 申请日期 2011.12.22
申请人 VALEO SYSTEMES DE CONTROLE MOTEUR;MORENO, JEAN-YVES 发明人 MORENO, JEAN-YVES
分类号 H05K3/00 主分类号 H05K3/00
代理机构 代理人
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