WAFER EXCHANGING DEVICE FOR CHEMICAL MECHANICAL POLISHING APPARATUS

摘要

Disclosed is a wafer exchanging device (10) for a chemical mechanical polishing apparatus, the wafer exchanging device (10) comprising a base (100); an elevating support (200); a first cylinder (300), the first cylinder (300) being connected to the lower part (240) of the elevating support (200) so as to lift and lower the elevating support (200), a piston rod (310) of the first cylinder (300) is passed through the lower part (240) of the elevating support (200) and fixed on the base (100); a basin contrapuntal ring (400), the contrapuntal ring (400) being mounted on an upper part (230) of the elevating support (200) by a spring (410), the inner edge on the top of the contrapuntal ring (400) having a curved surface adapted to the external profile of a polishing header (30) of the chemical mechanical polishing apparatus; a wafer bracket (500), the wafer bracket (500) being provided on the upper part of the contrapuntal ring (400); and a second cylinder (600), the second cylinder (600) being mounted on the contrapuntal ring (400), a piston rod (610) of the second cylinder (600) being passed through the contrapuntal ring (400) and being connected to the bottom of the wafer bracket (500) to lift and lower the wafer bracket (500), wherein the axis of the wafer bracket (500) and the axis of the second cylinder (600) are coincident with the axis of the contrapuntal ring (400).