| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an electroplating method which provides substantially uniform deposits of copper on the edges and walls of through-holes of a printed circuit board, and which provides copper deposits with high throwing power. <P>SOLUTION: The method includes: (a) providing an electroplating composition containing one or more sources of copper ions, 5-100 ppb of 3-mercaptopropane sulfonic acid, salts thereof or mixtures thereof, one or more additional brighteners, and one or more levelers; (b) immersing a substrate into the electroplating composition, the substrate provided with a plurality of through-holes, wherein knees and walls of the plurality of through-holes are coated with a first copper layer; and (c) electroplating a substantially uniform second copper layer on the first copper layer of the knees and the walls of the plurality of through-holes. <P>COPYRIGHT: (C)2012,JPO&INPIT |
