SPLIT SPUTTERING TARGET AND METHOD FOR PRODUCING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a technique which can effectively prevent mixing of the constituting material of a backing plate into the thin film to be deposited due to sputtering, in a split sputtering target obtained by joining a plurality of target members.

SOLUTION: In the split sputtering target formed by joining a plurality of target members on a backing plate by low melting point solder, the backing plate is provided with protective bodies along the gaps formed between the joined target members. The target members are made of an oxide semiconductor, and the protective bodies are made of a polymer sheet.

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