| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device which improves positioning accuracy at low cost and achieves the size reduction and high density assembly of a semiconductor chip, and to provide a manufacturing method of the semiconductor device. <P>SOLUTION: A first recessed part 5 on which a semiconductor chip 9 is placed is formed on a conductive pattern 4 of an insulation substrate with conductive patterns 1. A positioning external terminal 17 fastened to each conductive pattern 4 penetrates through a through hole 12 of a printed substrate with post pins 11, thereby positioning tips of the post pins 16 on a gate pad 9b and an emitter electrode pad 9a of the semiconductor chip 9. This structure significantly improves the positioning accuracy of the post pins 16 on the pad 9b at low cost. <P>COPYRIGHT: (C)2012,JPO&INPIT |
