| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an epoxy resin molding material for sealing having high adhesiveness to metals at high temperature and excellent in reflow resistant characteristics, and an electronic part or device provided with an element sealed with the same. <P>SOLUTION: The epoxy resin molding material for sealing comprises (A) an epoxy resin containing ≥2 epoxy groups in one molecule, (B) a curing agent, and (C) a mono- or di-hydric phenol derivative containing ≥1 nitrile groups in the molecular structure. It is preferable that the content of the mono- or di-hydric phenol derivative (C) containing ≥1 nitrile groups in the molecular structure is 0.1-1.0 mass%. Further, it is preferable that the molding material contains (D) a silane compound, (E) a cure accelerator, and (F) an inorganic filler. The electronic part or device is provided with the element sealed with the epoxy resin molding material for sealing. <P>COPYRIGHT: (C)2012,JPO&INPIT |
