| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device manufacturing method which can reduce a rework rate of a manufacturing process and a percent defective of a product. <P>SOLUTION: A semiconductor device manufacturing method comprises a step of forming a first pattern on a first processing target film on a semiconductor substrate, a first measurement step of measuring a first distance that is a dimension in a predetermined direction of the first pattern, a step of forming a second processing target film on the first pattern, a step of forming a second pattern on a photoresist formed on the second processing target film and a second measurement step of measuring a second distance that is a dimension in a predetermined direction of the second pattern. Quality of the second pattern is determined depending on at least one of the first distance and a calculation value calculated from the first distance and the second distance. <P>COPYRIGHT: (C)2012,JPO&INPIT |
