| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method for processing a base material, which can suppress a decrease in the conductivity of a conductor part containing copper formed on the base material on the side of a support base material, when the base material is temporarily fixed on the support base material, and thereafter separated from the support base material. <P>SOLUTION: The method for processing a base material includes a first step of feeding a temporary fixing agent containing a resin component having a norbornene-based resin as a main material to at least one of a base material having a functional surface having a conductor part containing copper and a support base material, and drying the temporary fixing agent to from a thin film, a second step of laminating the base material and the support base material through the thin film with the functional surface on the support base material side, a third step of processing a surface of the base material opposite to the functional surface, and a fourth step of heating the thin film to thermally decompose the resin component to thereby separate the base material from the support base material, wherein in the fourth step, the base material is cooled after the base material is separated from the support base material in a non-oxidizing atmosphere of ≤30 ppm in oxygen concentration. <P>COPYRIGHT: (C)2012,JPO&INPIT |
