发明名称 |
RELIABLE INTERCONNECT INTEGRATION SCHEME |
摘要 |
Embodiments relate to a method for forming reliable interconnects by preparing a substrate with a dielectric layer, processing the dielectric layer to serve as an IMD layer, wherein the IMD layer comprises a hybrid IMD layer comprising a plurality of dielectric materials with different k values. |
申请公布号 |
US2012168915(A1) |
申请公布日期 |
2012.07.05 |
申请号 |
US20100982862 |
申请日期 |
2010.12.30 |
申请人 |
DU LUYING;ZHANG FAN;CHEN JUN;ZHANG BEI CHAO;TAN JUAN BOON;GLOBALFOUNDRIES SINGAPORE PTE. LTD. |
发明人 |
DU LUYING;ZHANG FAN;CHEN JUN;ZHANG BEI CHAO;TAN JUAN BOON |
分类号 |
H01L29/02;H01L21/302 |
主分类号 |
H01L29/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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