PHOTOSENSITIVE RESIN COMPOSITION, OVERCOAT LAYER AND ELECTRONIC DEVICE USING THE SAME

摘要

Provided is a photosensitive resin composition, including: an organosiloxane polymer having one or more selected from the group consisting of an epoxy group, a glycidyl group and a hydroxyl group; an acrylate compound having an ethylenic unsaturated double bond; a photopolymerization initiator; and an organic solvent. The photosensitive resin composition is advantageous in that it can form a uniform and stable coating film when it is applied on a color substrate by spin coating and simultaneously can prevent spots, stains, blots and the like from occurring on the coating film, it can easily create patterns using a developer by curing a transmission film using a small amount of light, it does not generate cracks at a high temperature of 200 ~ 400°C, it has excellent load resistance even when it is heated at high temperature, it has excellent thermal stability because it generates a small amount of sublimate when it is fired, and in that the protective film obtained by curing the photosensitive resin composition has a transmissivity of 95% or more in a wavelength range of 400 ~ 800 nm, and the adhesivity between the protective film and a substrate is 5B or more.