| 摘要 |
PURPOSE: A printed circuit board and a manufacturing method thereof are provided to reduce manufacturing costs by excluding a pad forming process and an epoxy underplating process. CONSTITUTION: An insulating layer(160) protects an electric device(150) buried in a printed circuit board(100). The insulating layer is made of a thermosetting or thermoplastic polymer substrate, a ceramic substrate, an organic-inorganic composite substrate, or a glass fiber-impregnated substrate. A plurality of first circuit patterns(180) are formed on the upper side of the insulating layer as a base circuit pattern. A plurality of second circuit patterns(190) are formed beneath the insulating layer as a base circuit pattern. The first and second circuit patterns are formed of a material with high electric conductivity and low resistance.
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