CHIP ON BOARD HAVING LIGHT-EMITTING CHIP AND CHIP ON BOARD CAPABLE OF HAVING LIGHT-EMITTING CHIP

摘要

PURPOSE: A COB(Chip On Board) on which a light emitting chip is mounted and a COB on which the light emitting chip is mountable are provided to eliminate or minimize interference between light emitting diodes by not limiting a form of arranging light emitting packages of an COB type only on a horizontal line. CONSTITUTION: A heat radiating substrate(100) receives and emits heat emitted from light emitting diodes through a mounting part(250). A first non-conductive layer(200) performs an insulating function between the heat radiating substrate and an electrode layer(300). Via holes(a,b,c,d) of the heat radiating substrate and via holes(a',b',c',d') of the first non-conductive layer are located on a location where facing each other. The electrode layer is located on the first non-conductive layer. A second non-conductive layer(400) is located on the electrode layer.