| 摘要 |
PURPOSE: A ball mount device including an inkjet type flux tool is provided to reduce maintenance and repair costs of the ball mount device by dotting flux on a substrate without a flux pin. CONSTITUTION: A transfer unit transfers a substrate to a process position. A loading unit(110) comprises a loading picker(112) and a first guide device(114). A flux tool(170) dots flux on one side of the substrate which approaches the process position. The flux tool includes an inkjet which quantitatively discharges the flux by using an embedded heating element or piezoelectric device. A ball tool(124) attaches a solder ball to the flux dotted position of the substrate. |
