| 摘要 |
PURPOSE: A method for manufacturing a printed circuit board is provided to protect the surface of a first protective layer and effectively remove the residue on the first protective layer by inserting a second protective layer to the top of the first protective layer when forming bumps. CONSTITUTION: A pad(103) is connected to a circuit pattern formed on an insulating plate(101), which is made of a thermosetting or thermoplastic polymer substrate, a ceramic substrate, or an organic-inorganic composite substrate, by patterning a copper film formed on the insulating plate. Bumps(109) are formed on the pad. A plating seed layer(108) is formed on the bumps. A first protective layer(104) covers the front side of the circuit pattern and a part of the bumps.
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