| 摘要 |
A light emitting diode (LED) package and the manufacturing method thereof are provided. The LED package (400) comprises a substrate (404), at least one LED die (403), a lens (410) and an in-mold decoration film (40), wherein the LED die (403) is fixed on the substrate (404); the lens (410) is convexly molded on the substrate (404) to encapsulate the LED die (403); and the in-mold decoration film (40) has at least one phosphor layer (401) disposed on the lens (410) and a surface treatment layer (406) disposed on the phosphor layer (401). |
