发明名称 |
FABRICATION METHOD OF FLEXIBLE SUBSTRATE HAVING BURIED METAL ELECTRODE USING PLASMA, AND THE FLEXIBLE SUBSTRATE THEREBY |
摘要 |
PURPOSE: A flexible substrate burying a metal wiring of low resistance using plasma and a manufacturing method thereof are provided to remove impurities by performing plasma pretreatment. CONSTITUTION: A substrate is pretreated by emitting plasma. A metal wiring is formed on the pretreated substrate. A polymer layer with the metal wiring is formed by coating and hardening a curable polymer on the upper part of the substrate. The manufactured polymer layer is separated from the pretreated substrate. |
申请公布号 |
KR101161301(B1) |
申请公布日期 |
2012.07.04 |
申请号 |
KR20120053626 |
申请日期 |
2012.05.21 |
申请人 |
KOREA INSTITUTE OF MACHINERY & MATERIALS |
发明人 |
KANG, JAE WOOK;KIM, DO GEUN;KIM, JONG KUK;JUNG, SUNG HUN;LEE, SEONG HOON |
分类号 |
H05K1/02;H05K3/20;H05K3/46 |
主分类号 |
H05K1/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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