发明名称 FABRICATION METHOD OF FLEXIBLE SUBSTRATE HAVING BURIED METAL ELECTRODE USING PLASMA, AND THE FLEXIBLE SUBSTRATE THEREBY
摘要 PURPOSE: A flexible substrate burying a metal wiring of low resistance using plasma and a manufacturing method thereof are provided to remove impurities by performing plasma pretreatment. CONSTITUTION: A substrate is pretreated by emitting plasma. A metal wiring is formed on the pretreated substrate. A polymer layer with the metal wiring is formed by coating and hardening a curable polymer on the upper part of the substrate. The manufactured polymer layer is separated from the pretreated substrate.
申请公布号 KR101161301(B1) 申请公布日期 2012.07.04
申请号 KR20120053626 申请日期 2012.05.21
申请人 KOREA INSTITUTE OF MACHINERY & MATERIALS 发明人 KANG, JAE WOOK;KIM, DO GEUN;KIM, JONG KUK;JUNG, SUNG HUN;LEE, SEONG HOON
分类号 H05K1/02;H05K3/20;H05K3/46 主分类号 H05K1/02
代理机构 代理人
主权项
地址