发明名称 Polyamide resin composition
摘要 A polyamide resin composition according to the present invention comprises (A) crystalline polyamide resin having a glass transition temperature (Tg) of about 50 to about 100°C; (B) crystalline polyamide resin having a glass transition temperature (Tg) of about 110 to about 160°C; (C) inorganic filler; (D) white pigment; and (E) light stabilizer, and can have excellent surface gloss, surface reflectance, heat resistance, mechanical strength, moldability, light stability and discoloration resistance.
申请公布号 EP2471868(A1) 申请公布日期 2012.07.04
申请号 EP20110196077 申请日期 2011.12.29
申请人 CHEIL INDUSTRIES INC. 发明人 SANG HWA LEE;IN SIK SHIM;PIL HO KIM;IN GEOL BAEK;JONG CHEOL LIM
分类号 C08L77/00;C08L77/06 主分类号 C08L77/00
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