SEMICONDUCTOR CHIP, METHOD OF MANUFACTURING SEMICONDUCTOR CHIP AND SEMICONDUCTOR MODULE USING THE SAME

摘要

PURPOSE: A semiconductor chip, a manufacturing method thereof, and a semiconductor module including the same are provided to improve the timing margin and voltage margin of input and output signals by including a resistance structure which is electrically connected between the through silicon via and a substrate. CONSTITUTION: A through silicon via(110) passes through both sides of a substrate(170). A resistance structure(130) is electrically connected between the through silicon via and the substrate. A pad(150) is formed on the substrate with a contact or via shape. A redistribution layer(171) includes a first conductive pattern(120) and a second conductive pattern(140). The first conductive pattern electrically connects the through silicon via and the resistance structure.