发明名称 BOARD FOR RADIATING HEAT USING ELECTRO-DEPOSITION COATING AND METHOD FOR MANUFACTURING THE SAME
摘要 PURPOSE: A high heat sink board using an electro-deposition coating and a manufacturing method thereof are provided to improve heat conductivity and heat dissipation by forming a second insulation layer with the electro-deposition coating after a first insulation layer is formed by anodizing. CONSTITUTION: A metal core is prepared(S110). A first insulation layer is formed on the metal core by anodizing(S120). A second insulation layer is formed by electro-deposition coating the metal core with the first insulation layer(S130). A circuit layer is formed(S140).
申请公布号 KR20120072801(A) 申请公布日期 2012.07.04
申请号 KR20100134697 申请日期 2010.12.24
申请人 SAMSUNG ELECTRO-MECHANICS CO., LTD. 发明人 SHIN, SANG HYUN;LEE, YOUNG KI;HEO, CHEOL HO
分类号 H01L23/36;H01L33/64 主分类号 H01L23/36
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