发明名称
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a capacitor incorporated in a wiring board, of which adhesion to a resin material is improved, and to provide a wiring board whose reliability is sufficiently assured. <P>SOLUTION: The capacitor 1 which is incorporated in the wiring board comprises a capacitor body 2 consisting of a plurality of dielectric layers 3 stacked together, and internal electrode layers 4 and 5 arranged between different dielectric layers 3. A recess 2d extending in thickness direction of the capacitor body 2 is formed on side surfaces 2c1-2c3 of the capacitor body 2. <P>COPYRIGHT: (C)2007,JPO&INPIT</p>
申请公布号 JP4965237(B2) 申请公布日期 2012.07.04
申请号 JP20060344987 申请日期 2006.12.21
申请人 发明人
分类号 H01L23/12;H01G2/06;H01G4/30;H05K1/18;H05K3/46 主分类号 H01L23/12
代理机构 代理人
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