发明名称 CONTACT-BONDING DEVICE
摘要 A compression bonding device capable of packaging electric components on both sides of a substrate is provided. A compression bonding device 1 includes first and second pressing rubbers 15, 25. Electric components 32, 33 can be simultaneously packaged on the front face and the rear face of a substrate 31 by sandwiching the substrate 31 between the first and second pressing rubbers 15, 25. The electric components 32, 33 are not subjected to a force for horizontally moving them because the first and second pressing rubbers 15, 25 are prevented from horizontal extension by a first dam member 16. Thus, the electric components 32, 33 are connected to the substrate 31 without misalignment, thereby obtaining a highly reliable electric device 30a.
申请公布号 EP1983564(A4) 申请公布日期 2012.07.04
申请号 EP20070713933 申请日期 2007.02.08
申请人 SONY CHEMICAL & INFORMATION DEVICE CORPORATION 发明人 MATSUMURA, TAKASHI
分类号 B30B15/02;B30B5/02;B30B15/06;H01L21/603;H05K3/30 主分类号 B30B15/02
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