发明名称 |
SEMICONDUCTOR LASER MODULE |
摘要 |
In order to obtain a semiconductor laser module in which breakage is not made in a cooling process during sealing with glass, magneto-striction deformation is in an acceptable range, and a large current can be flown, the semiconductor laser module includes: a semiconductor laser element (10) which emits light by the supply of a current; a package base (1) having a through hole (1A); a lead pin (2) which passes through the through hole (1A) and supplies the current to the semiconductor laser element (10); a glass material (3) which seals the through hole (1A) through which the lead pin (2) passes through; and a cap (30) which has a window (31) from which light emitted by the semiconductor laser element (10) is taken out and has the semiconductor laser element (10) in the inside thereof, the cap (30) being hermetically joined to the package base (1). The lead pin (2) is an iron-nickel alloys in which the coefficient of linear expansion is not higher than a predetermined ratio in difference with the glass material (3), the saturation magneto-striction constant is not higher than a predetermined value, and volume resistivity is not higher than a predetermined rate. |
申请公布号 |
EP2472680(A1) |
申请公布日期 |
2012.07.04 |
申请号 |
EP20100844509 |
申请日期 |
2010.01.27 |
申请人 |
MITSUBISHI ELECTRIC CORPORATION |
发明人 |
TAMAYA, MOTOAKI;NAKAMURA, AKIRA;NANBA, CHISE |
分类号 |
H01S5/022;H01L23/10;H01R13/52 |
主分类号 |
H01S5/022 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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