THE PRINTED CIRCUIT BOARD AND THE METHOD FOR MANUFACTURING THE SAME

摘要

PURPOSE: A printed circuit board and a manufacturing method thereof are provided to prevent the bending of a substrate during processes by using a metal substrate including metal laminate. CONSTITUTION: A core insulation layer comprises a first insulation layer(120) and a second insulation layer(125) which are formed of a thermosetting or thermoplastic polymer substrate, a ceramic substrate, or an organic-inorganic composite substrate. Via holes(115) and an internal circuit layer(111) are formed in the core insulation layer. First and second external circuit layers(131,135,145) are formed on the first and second insulation layers. The via holes include a first part(115a) formed of copper-containing alloy, a second part(115b) buried in the second insulation layer, and a third part formed between the first and second parts.