| 摘要 |
A light-emitting device package uses a metal layer (10) as a reflective region and includes a light-emitting device chip (50) and an electrode pad (60) that are disposed on an insulating layer (20). In addition, the electrode pad and an electrode pattern of a printed circuit board (30) are connected to each other by an electrode pattern (70) formed of conductive ink. A method of manufacturing a light-emitting device package includes forming an insulating layer on a metal layer, and bonding a light-emitting device chip and an electrode pad on the insulating layer. The electrode pad and a printed circuit board are connected to each other by conductive ink. |
