BONDED SUBSTRATES AND METHODS FOR BONDING SUBSTRATES.

摘要

Herein are disclosed apparatus and methods for impinging heated fluids onto the surfaces of substrates to heat the surfaces of the substrates so as to facilitate melt-bonding the substrates to each other to form a laminate. Also are disclosed are laminates in which a fibrous web is bonded to a substrate in a surface-bonded manner and/or is bonded in a loft-retaining manner. The substrate may comprise protrusions on the surface of the substrate opposite the surface that is bonded to the fibrous web.