THE PRINTED CIRCUIT BOARD AND THE METHOD FOR MANUFACTURING THE SAME

摘要

PURPOSE: A printed circuit board and a manufacturing method thereof are provided to obtain plating adhesion by forming a primer resin layer between an insulating layer and an external circuit layer. CONSTITUTION: A core insulation layer comprises a first insulation layer(120) and a second insulation layer(125) which are formed of a thermosetting or thermoplastic polymer substrate, a ceramic substrate, or an organic-inorganic composite substrate. Adhesive layers(160,165) are formed on the surface of the core insulation layer, on the top surface of the first insulation layer and the bottom surface of the second insulation layer, in order to strengthen the adhesion between the first and second insulation layers and upper circuit layers(131,135,145). Via holes(115) and an internal circuit layer(111) are formed in the core insulation layer.