| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a photosensitive siloxane composition having low cure shrink properties and capable of giving a cured film which excels in transparency after heat curing, suppresses cracking after impregnation with an alkali solvent and excels in adhesiveness to a substrate. <P>SOLUTION: The photosensitive siloxane composition comprises: (a) a polysiloxane obtained by reacting an imide group-containing silane compound represented by general formula (1) with one or more organosilane compounds; (b) a quinonediazide compound; and (c) a solvent; wherein respective R<SP>1</SP>s may be the same or different and each represents one of a 1-6C alkyl group, a 1-6C alkoxyl group, a phenyl group, a phenoxy group and an organic group in which those are substituted; R<SP>2</SP>represents a 1-10C divalent organic group; and R<SP>3</SP>represents a 5-20C organic group containing no silicon atom. <P>COPYRIGHT: (C)2008,JPO&INPIT |
