发明名称 Polyamide Resin Composition
摘要 A polyamide resin composition according to the present invention comprises (A) 10 to 70 % by weight of crystalline polyamide resin, (B) 10 to 70 % by weight of amorphous polyamide resin with a glass transition temperature of 110 to 200 °C, (C) 10 to 60 % by weight of inorganic filler, (D) 10 to 50 % by weight of white pigment, and (E) 0.05 to 2 parts by weight of light stabilizer, based on 100 parts by weight of the crystalline polyamide resin (A), the amorphous polyamide resin (B), the inorganic filler (C) and the white pigment (D), and can have excellent surface reflectance, heat resistance, mechanical strength, moldability, light stability and discoloration resistance.
申请公布号 EP2471866(A1) 申请公布日期 2012.07.04
申请号 EP20110195781 申请日期 2011.12.27
申请人 CHEIL INDUSTRIES INC. 发明人 LEE, SANG HWA;SHIM, IN SIK;KIM, PIL HO;BAEK, IN GEOL;LIM, JONG CHEOL
分类号 C08L77/00;C08K3/00;C08K5/00;C08K5/16;C08K7/14 主分类号 C08L77/00
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