发明名称 |
Integrated circuit packaging system with lead frame and method of manufacture thereof |
摘要 |
A method of manufacture of an integrated circuit packaging system includes: providing a base substrate; attaching a base device over the base substrate; attaching a leadframe having a leadframe pillar adjacent the base device over the base substrate; applying a base encapsulant over the base device, the base substrate, and the leadframe; removing a portion of the base encapsulant and a portion of the leadframe providing the leadframe pillar partially exposed; and attaching a base substrate connector to the base substrate directly below the leadframe pillar.
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申请公布号 |
US8211746(B2) |
申请公布日期 |
2012.07.03 |
申请号 |
US201113117500 |
申请日期 |
2011.05.27 |
申请人 |
HA JONG-WOO;KANG TAEWOO;MOON DONGSOO;STATS CHIPPAC LTD. |
发明人 |
HA JONG-WOO;KANG TAEWOO;MOON DONGSOO |
分类号 |
H01L21/00 |
主分类号 |
H01L21/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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