| 摘要 |
PURPOSE: An LED package is provided to improve the screen quality of a liquid display device by enhancing the incident efficiency of a light guide plate through a first reflection layer on the lower surface of an encapsulant. CONSTITUTION: An LED chip(114) is mounted on a chip mounting area of a substrate(110). A lead electrode is electrically connected to the LED chip. An encapsulant(118) is formed on the upper side of the LED chip. A first reflection layer(120) is formed on the lower surface of the encapsulant at a preset height. A second reflection layer(140) is formed on the upper surface of the substrate. |
